Capabilities

Design through Final Production

Circuit Board Assembly & Testing

  • Assembly: Surface Mount as small as 01005 and Thru-hole
  • Testing: Functional, Bed of Nails, Thermal Shock and Cycling, Altitude Chamber
  • Technologies

  • Organic Substrates: FR4, Aluminum Clad, Polyimide
  • Ceramic Substrates: Al2O3, AlN, BEO
  • Processes for Conductors and Resistor Networks

  • Laser Trim Resistors and Capacitors
  • Die Attach
  • Wire-Bond (Thermosonic and Ultrasonic)
  • Encapsulating
  • Parylene Coating
     
  • Electronics for American Industry & Defense

    585.328.2000     Rochester, NY

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