News &
Announcements

2014 News & Announcements

Advance Circuit Technology, Inc. has purchased 2 new iico high speed pick and place machines from Europlacer.  Combining all around capability, the iico is perfect for low to medium-volume, high-mix production. iico can place 0201s to the largest QFPs on the market, as well as components that cannot be handled by conventional vacuum nozzles, the system incorporates a high level of flexibility rarely found in low-cost solutions.  The machine head includes an 8 position rotary turret on an X/Y gantry utilizing ‘on the fly’ vision, it maintains high placement rates even on boards with a wide range of components. 
View Europlacer iico Specifications

 

In addition, Advance Circuit Technology, Inc. has purchased a Palomar 8000i Wire Bonder. The 8000i Wire Bonder is a fully automatic, thermosonic, high-speed Au/Pt bumper, ball and wire bonder. The 8000i Wire Bonder supports complex, high-mix automated production for wire bonding, ball/stud bumping and complex IC attach.
View Palomar 8000i Wire Bonder Data Sheet
 

Electronics for American Industry & Defense

585.328.2000     Rochester, NY

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